Among those famous China back grinding wheel manufacturers, Yinglong Superhard Materials Manufactory is a professional such supplier, welcome to buy sic grinding wheel, sapphire grinding wheel, grinding wheel for led production with our factory.
Back Grinding Wheel for Sapphire Thinning
General Information;
In Front of the Original Semiconductor Processing, Grinding, Thinning and Polishing of the Wafer Substrate, a Wide Variety of Diamond Grinding Wheel would be Used for Back Grinding & Processing the Grinding Wheel.
Based on Various Types of Wafer Materials, like Sapphire Substrate, SiC Substrate, GaAs Substrate, Silicon Substrate, Different Diamond Grinding Wheels would be Chosen, such as Diamond Vitrified Grinding Wheels, Metal Grinding Wheels, Resin Grinding Wheels.
In the Process of Machining, “HeroHome” Diamond Grinding Wheels are with Long Life, Advantageous Grinding and Thinning Result, Great Extent to Meet the Industry Machining Accuracy and Surface Finish Requirements for Optical Industry and Solve the Weakness of Machining Scratches on the Wafer Surface.
Regular Size of Grinding Wheels of Sapphire Grinding & Thinning;
Item |
Size(MM) |
Abrasive |
Grain Size |
Bond |
Usage |
Back Grinding Wheel for Thinning Sapphire |
D150*M12*T28*W15*X6 |
Diamond |
240#/280# Or as the requirement of customer |
Resin Metal Vitrified |
For thinning the Sapphire, Silicon, GaAs Substrate |
D202*H30*T20 with Groove | |||||
D209*H158*T23.3 | |||||
D250/252*H28*T46 | |||||
D255*H92*T45 | |||||
D265*H28*T43.6 | |||||
D302*H110*T35 | |||||
D358*H120*T68 | |||||
The Grinding Wheels could be also be produced as customers’ requirement. |
How to purchase Grinding Wheel from us?